CALL FOR PAPERS
The Second International Workshop on
SecSDN: Secure & Dependable Software Defined Networking for Sustainable Smart Communities
(in Conjunction with IEEE ICC 2019)
20-24 May 2019, Shanghai, China
The 2nd IEEE GLOBECOM Workshop on SecSDN: Secure & Dependable Software Defined Networking for Sustainable Smart Communities will be held in Shanghai, China on May 20, 2019 in conjunction with IEEE ICC 2019.
The emergence of SDN technology helps to isolate the control plane from the data plane and solves the issues through network programmability. The SDN is a centralized approach and easily modify the network topology, and in addition maintain data consistency and interoperability among heterogeneous IoT devices with the help of automation. Although SDN technology performs resilient and reliable connections in heterogeneous environment based on secure communication protocols designed by the network programmers but still chances of security threats may occur as single controller is handling the complete network infrastructure. With the widespread adoption of wireless sensors in smart communities, the device-to-device communication is susceptible to security vulnerabilities and resulting in devastating attacks on the network controller. IoT-enabled devices are insecure as for example sensors may be infected by malware attack have subsequently comprised the control plane. Consequently, ensuring the security and privacy techniques may contribute to defend from security attacks and provide reliable services in smart communities. Moreover, the higher costs, overhead and complexity of traditional cryptographic primitives make it necessary to design lightweight and novel security solutions for SDN in smart communities. The amalgamation of multiple technologies in smart communities makes it further necessary to provide secure communication and computing paradigm.
Addressing the need for a flexible network architecture that adapts to the diverse requirement of end users in smart communities, this workshop aims to serve as a platform for researchers from academia and industries, to promote the design and development of new ideas, tools and technologies related to Secure and Dependable SDN in Smart communities.
Topics include (but not limited to):
+ Security and privacy for innovative service delivery models
+ Lightweight Cryptography in wireless sensors nodes for SDN
+ Quantum Cryptography in heterogeneous IoT devices for SDN
+ Secure device-to-device communication
+ Authentication, authorization, and access control (AAA)
+ Anomaly detection and prevention mechanisms
+ Secure integration of IoT and fog devices for SDN
+ Intrusion detection system and intrusion prevention system
+ Heterogeneous model & trustworthy communication architectures
+ Secure data storage and computing model in SDN
+ Testbed and experimental components tailored for SDN
+ Security threats and vulnerability detection
+ Block chain for secure transaction management using SDN
+ Deduplication architectures for secure cloud storage
+ Security and privacy standardization for SDN
+ Dependable control plane optimization for SDN
Dr. Neeraj Kumar, Associate Professor,
Computer Science and Engineering Department,
Thapar Institute of Engineering and Technology (deemed to be University), Patiala (Punjab), India
Prof. Mohammad S. Obaidat, Fellow of IEEE and Professor,
King Abdullah School of Information Technology,
University of Jordan, Jordan.
Email: firstname.lastname@example.org, email@example.com
TPC Chair and Publicity Chair
Dr. Gagangeet Singh Aujla, Associate Professor,
Computer Science and Engineering Department,
Chandigarh University, Mohali (Punjab), India
Email: firstname.lastname@example.org, email@example.com
+ Paper Submission Deadline: Jan. 25, 2019
+ Acceptance Notification: Feb. 15, 2019
+ Final Paper Submission: Mar. 5, 2019
The Author and Submission Guidelines apply. All submissions should be written in English with a maximum paper length of six (6) printed pages for full papers (10-point font) including figures without incurring additional page charges (maximum 1 additional page with over length page charge of USD 100 if accepted). The maximum paper length for short papers is three (3) printed pages including figures.
Papers must be submitted via EDAS.
Papers exceeding 7 pages will not be accepted at EDAS.
Standard IEEE conference templates for LaTeX formats are found at http://www.ieee.org/conferences_events/conferences/publishing/templates.html You may also use one of the following templates for Microsoft Word: A4, US letter. Only PDF files will be accepted for the review process, and all submissions must be done through EDAS. Accepted Papers will be published in the ICC 2019 Workshops Proceedings and submitted to IEEE Xplore.